Umgomo wezobuchwepheshe: Imisebe ye-laser enegciwane eliphezulu (efana ne-nanosecond/picosecond pulse lasers) igxilwe ebusweni be-silicon wafers, futhi ukuhamba kwemathiriyeli noma ukushiswa kufezwa ngokushesha okukhulu kokushisa ukuze kuqedwe ukusika. I-wavelength ejwayelekile ye-laser ingu 1.06 μ m (i-semiconductor laser) noma 1064nm (i-fiber laser).
Izinzuzo eziyisisekelo:
Ukunemba okuphezulu: Ukunemba kokusika kungafinyelela ku-± 10 μ m, futhi ububanzi bendawo ethintwe ukushisa (HAZ) bungaphansi kuka-20 μ m, okungcono kakhulu kune-± 50 μ m ukunemba kokusika kwemishini.
Ukucubungula okungathintwa: kugwema ingozi yokuphuka okubangelwa ukucindezela kwemishini, ngokukhipha okuphakeme kwe-99.5%.
Isivinini esiphezulu: Isivinini sokusika singafinyelela ku-1200mm/s, futhi idivayisi eyodwa ingakhiqiza ngaphezu kwezingu-5000 ngosuku.