Imininingwane enzuzo
Indlela yokuthumela:快递
Ukubonisa umlingani
Teknikal prinsip: Beam laser energi tinggi (sapertos nanodetik/pikodetik pulsa laser) difokuskeun kana permukaan wafer silikon, sareng evaporasi atanapi lebur bahan dicapai ngalangkungan suhu tinggi instan pikeun ngalengkepan motong. Gelombang laser tipikal nyaéta 1.06 μ m (laser semikonduktor) atanapi 1064nm (laser serat).
Core advantages:
High precision: The cutting accuracy can reach ± 10 μ m, and the width of the heat affected zone (HAZ) is less than 20 μ m, significantly better than the ± 50 μ m accuracy of mechanical cutting.
Non contact processing: avoids the risk of cracking caused by mechanical stress, with a cutting yield of over 99.5%.
High speed: The cutting speed can reach 1200mm/s, and a single device can produce over 5000 pieces per day.
Core advantages:
High precision: The cutting accuracy can reach ± 10 μ m, and the width of the heat affected zone (HAZ) is less than 20 μ m, significantly better than the ± 50 μ m accuracy of mechanical cutting.
Non contact processing: avoids the risk of cracking caused by mechanical stress, with a cutting yield of over 99.5%.
High speed: The cutting speed can reach 1200mm/s, and a single device can produce over 5000 pieces per day.