High-precision vision-guided system enables 5.5-second/string rapid stacking with ±0.2mm accuracy. Supports 60/72-cell standard formats and flexible switching for half-cut, bifacial modules. Available in gantry or robotic arm configurations, customizable for 156-230mm wafers and irregular modules.

Fully automated trimming system with elastic-contact blades, precisely removing laminator flash with ≤0.5mm residue and ≥98% uptime. Handles modules 600-1000mm wide and 1400-2000mm long, with simultaneous four-side cutting and waste collection for smooth, damage-free edges.

Covers 100MW-1GW full-process PV module manufacturing, integrating 42 core devices including scribing, stringing, shingling, stacking, framing, and trimming. Supports flexible combination of new/refurbished equipment. Equipped with AI defect detection, MES traceability, and bilingual control, achieving 90-day delivery. Delivered over 10GW capacity to 50+ countries.

Equipped with laser scribing technology, it supports four-sided, rounded or chamfered cutting of 156-210mm silicon wafers with ±0.05mm precision, achieving ≤800 pieces/hour (for 166×166mm wafers with 4 cuts). Non-contact processing minimizes wafer damage, compatible with mono/polycrystalline wafers, ideal for precision cutting in PV cell production.

High-precision stringer compatible with 156-210mm cells and 5BB-20BB busbar designs, featuring ±0.15mm solder ribbon positioning accuracy and ≤0.2% cell breakage rate. Utilizes high-frequency electromagnetic welding for SMBB ultra-fine ribbons, integrated with CCD vision inspection for automated loading/unloading and defect detection, suitable for PERC, TOPCon, HJT cells.

Electromagnetic induction welding system with SCARA robot and vision for ±0.05mm shingling precision, supporting small-cell series welding at 10,000 pieces/hour. Equipped with automatic busbar cutting/punching, handles lead welding and bypass ribbon processes, ideal for high-efficiency shingled and half-cut modules.

High-precision vision-guided system enables 5.5-second/string rapid stacking with ±0.2mm accuracy. Supports 60/72-cell standard formats and flexible switching for half-cut, bifacial modules. Available in gantry or robotic arm configurations, customizable for 156-230mm wafers and irregular modules.

Fully automated trimming system with elastic-contact blades, precisely removing laminator flash with ≤0.5mm residue and ≥98% uptime. Handles modules 600-1000mm wide and 1400-2000mm long, with simultaneous four-side cutting and waste collection for smooth, damage-free edges.

Covers 100MW-1GW full-process PV module manufacturing, integrating 42 core devices including scribing, stringing, shingling, stacking, framing, and trimming. Supports flexible combination of new/refurbished equipment. Equipped with AI defect detection, MES traceability, and bilingual control, achieving 90-day delivery. Delivered over 10GW capacity to 50+ countries.